MCM with Heatsink

The MCM with Heatsink is a fully integrated packaging solution designed for high-performance, thermally demanding applications. By combining a Multi-Chip Module (MCM) with a custom-engineered heatsink, Accurate Engineering delivers unmatched electrical performance and thermal management in one compact package.

Key Features of Multi‑Chip Module with Heatsink

• Integrated Thermal Management: Custom heatsinks directly attached to the MCM package maximize heat dissipation and improve reliability.
• High-Density Integration: Combines multiple ICs and passive components in a single module, reducing footprint and interconnect length.
• Custom Heatsink Options: Machined, extruded, or bonded-fin heatsinks designed for specific thermal resistance requirements.
• Optimized Electrical Performance: Short interconnects reduce parasitic effects for superior signal integrity.
• Wide Material Choices: Ceramic, high-Tg organic, or hybrid substrates with copper cores available for enhanced thermal performance.
• IPC Class 3 & MIL-Spec Compliance: Built to the most stringent reliability standards for mission-critical applications.

Technical Specifications of Multi‑Chip Module with Heatsink

• Package Types: Wire bond, flip-chip, stacked die, or mixed configurations
• Substrate Materials: Ceramic (Alumina, Aluminum Nitride), BT epoxy, or copper-core hybrid
• Layer Count: 4–20+ layers depending on module complexity
• Heatsink Materials: Aluminum alloys (6061/6063) or copper with optional Chem-Film, anodizing, or nickel plating
• Surface Finish: ENIG, ENEPIG, Hard Gold, Immersion Silver, HASL
• Operating Temperature: -55°C to +150°C
• Thermal Resistance: Fully customizable based on power dissipation requirements

Applications of Multi‑Chip Module with Heatsink

• Aerospace & Defense: Radar processors, avionics modules, and rugged embedded systems
• High-Speed Computing: Multi-processor AI modules and FPGA-based accelerators
• Telecommunications: RF front-end modules and high-power base station equipment
• Automotive Electronics: Power electronics, ADAS controllers, and advanced ECUs
• Medical & Industrial Equipment: Devices requiring compact, high-reliability packaging with robust thermal control

Benefits of Multi‑Chip Module with Heatsink

The MCM with Heatsink provides high integration and superior thermal performance in a single assembly:

• Improved Reliability: Efficient heat removal protects sensitive components from thermal stress.
• Smaller Footprint: Consolidates multiple discrete boards into one compact module with integrated cooling.
• Performance Optimization: Shorter interconnects reduce latency and power loss in high-speed designs.
• Customization: Heatsinks can be designed with various fin geometries, mounting options, and finishes to meet system-level needs.

Compared to separate MCM and heatsink assemblies, this integrated solution simplifies assembly and ensures optimized thermal coupling.

Why Choose Accurate Engineering?

• Expertise in MCM & Thermal Design: Decades of experience in advanced packaging and heatsink engineering
• State-of-the-Art Manufacturing: In-house substrate fabrication, assembly, and heatsink machining
• Custom Thermal Solutions: Tailored heatsink designs with thermal modeling support for your power dissipation requirements
• Quality Assurance: All assemblies meet IPC Class 3 and RoHS standards; optional MIL-STD thermal testing available

The MCM with Heatsink is the perfect choice for engineers needing high-density integration and advanced thermal management in one rugged, space-saving module.