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Rigid-Flex Capability
- PCB Specifications
- Drilling & Hole
- Minimum trace & Spacing
- Silkscreen
- Solder Mask
- Panelization
- Stack up Example
| Category | Capability |
|---|---|
| Layers | 1-32 layers |
| Laminated Structure | 3 - 32 layers |
| Material Type | Fr-4 - High TG |
| Polyimide - High TG | |
| Rogers - High TG | |
| Teflon - High TG | |
| Adhesives | |
| Acryllic | |
| Dimensions | minimum size - 2x2 inches |
| maximum - 18x24 inches | |
| Board thickness | 0.13mm(5mil)-6.35mm(250 mil) |
| Board thickness tolerance | T≥1.0mm：±10% |
| T<1.0mm：±0.1mm | |
| Inner layer/outer layer copper thickness | inner layer: 0.25oz, 0.5oz, 1oz, 2oz, 3oz, 4oz |
| outer layer: 0.25oz, 0.5oz, 1oz, 2oz, 3oz, 4oz | |
| imaging production | LDI, Negative film, pattern electroplating |
| Surface Treatment | Bare Copper, , HASL With Lead, HASL Lead-free, Immersion Gold, Immersion Tin, Immersion Silver, Nickel Palladium Gold, Selective Immersion Gold, Lead-free HASL + Selective Immersion Gold, Lead-free HASL + Selective Gold Plating |
| Plugged Vias | Solder mask ink, San-ei, conductive and non-conductive resin fillers |
| Metal edging process | Metal edging copper thickness ≥ 15um(0.6mil) |
| Electrical Test | Flying probe test: net list enc to end up to 500 volts |
| edge rail | >= 7.62mm(300mil) |
| Category | Capability |
|---|---|
| Drill hole size | 0.15mm(6mil)~6.5mm(256mil) |
| Rate of finished board thickness to min plated hole diameter | 10/1 ratio |
| Counter sink hole | 1. Hole size specification: <6.5mm(256mil) |
| 2. Angle: 90° 140° 180° | |
| 3. Hole size tolerance: ±0.05mm(2mil) | |
| 4. Depth Tolerance: ±0.15mm(6mil) | |
| Drill hole tollerance | 1. Diameter of plug-in hole: +/-0.075mm(3mil) |
| Minimum via/pad | Double-side board: 0.2mm(8mil) (inner diameter)/0.5mm(20mil) (outer diameter) |
| Multi-layer board: 0.15mm(6mil) (inner diameter)/0.25mm(10mil) (outer diameter) | |
| Preferred Min. Via hole size: 0.2mm(8mil) | |
| Min. Plated Slot | Width≥0.7mm(28mil) |
| Min. Non-Plated Slots | Width≥0.8mm(31mil) |
| Plated Hole Copper Thickness | 18um(0.7mil)-100um(4mil) |
| Category | Capability |
|---|---|
| Min. trace width/spacing (1OZ) | 0.076/0.076mm(3mil/3mil) |
| Min. trace width/spacing (2OZ) | 0.14/0.14mm (5.5mil/5.5mil) |
| Min. trace width/spacing (3OZ) | 0.2/0.2mm (8mil/8mil) |
| Min. trace width/spacing (4OZ) | 0.25/0.25mm (10mil/10mil) |
| Trace Width Tolerance | ±20% |
| Pad Edge to trace Edge Spacing | ≧0.1mm |
| Width of solder ring for plated holes(1oz) | ≧0.05mm(2mil) |
| BGA | BGA pad diameter: ≧0.2mm(8mil) |
| BGA pad edge to trace edge: ≧0.075mm(3mil) |
| Category | Capability |
|---|---|
| Text height | h≧0.75mm(3mil),character width 0.1mm(4mil) |
| Text Width | >=0.1(4mil) |
| Spacing from character to exposed copper pads | ≧0.15mm(6mils) |
| Color | Green, Cold White, Blue, Black, Yellow, Red, Purple, Matte Black, Matte Green |
| Solder Mask Thickness | ≧10um(0.4mil) |
| Minimum Solder Bridge Width | Green: 0.075mm(3 mil) |
| profiling | V-cut | Angle: 25°, 30° |
| According to different plate thickness: | ||
| Remaining thickness: 0.25(10mil)-0.8mm(31mil) | ||
| Remaining thickness tolerance: ±0.1mm(4mil) |
| 4 layers | |
| top mask | Soldermask |
| top copper layer(rigid) | copper |
| prepreg | |
| 2 copper layer(flex) | copper |
| adhessive | |
| 3rd copper layer(flex) | copper |
| prepreg | |
| bottom copper layer(rigid) | copper |
| bot mask | Soldermask |