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Flexible PCB Capabilities
- PCB Specifications
- Drilling & Hole
- Minimum trace & Spacing
- Silkscreen
- Solder Mask
- Panelization
- Stack up Example
| Category | Capability |
|---|---|
| Layers | 1-6 layers |
| Laminatyed Structure | 3-6 layers |
| Material Type | FRK |
| Polyemit | |
| Capton | |
| Adhesives | |
| Acryllic | |
| Dimensions | mimumum size - 2x2 inches |
| maximum - 14x16 inches | |
| Board thickness tolerance | T≥1.0mm：±10% |
| T<1.0mm：±0.1mm | |
| Inner layer/outer layer copper thickness | inner layer: 0.25oz, 0.5oz, 1oz, 2oz |
| outer layer: 0.25oz, 0.5oz, 1oz, 2oz | |
| imaging production | LDI, Negative film, pattern electroplating |
| Surface Treatment | Bare Copper, , HASL With Lead, HASL Lead-free, Immersion Gold, Immersion Tin, Immersion Silver, Nickel Palladium Gold, Selective Immersion Gold, Lead-free HASL + Selective Immersion Gold, Lead-free HASL + Selective Gold Plating |
| Electrical Test | Flying probe test: net list enc to end up to 500 volts |
| Category | Capability |
|---|---|
| Drill hole size | 0.15mm(6mil)~6.5mm(256mil) |
| Rate of finished board thickness to min plated hole diameter | 10/1 ratio |
| Drill hole tollerance | 1. Diameter of plug-in hole: +/-0.075mm(3mil) |
| Plated Hole Copper Thickness | 18um(0.7mil)-100um(4mil) |
| Category | Capability |
|---|---|
| Min. trace width/spacing (0.25OZ) | 0.076/0.076mm(3mil/3mil) |
| Min. trace width/spacing (0.5OZ) | 0.076/0.076mm(3mil/3mil) |
| Min. trace width/spacing (1OZ) | 0.076/0.076mm(3mil/3mil) |
| Min. trace width/spacing (2OZ) | 0.14/0.14mm (5.5mil/5.5mil) |
| Trace Width Tolerance | ±20% |
| Width of solder ring for plated holes(1oz) | ≧0.05mm(2mil) |
| Category | Capability |
|---|---|
| Text height | h≧0.75mm(3mil),character width 0.1mm(4mil) |
| Text Width | >=0.1(4mil) |
| Spacing from character to exposed copper pads | ≧0.15mm(6mils) |
| Category | Capability |
|---|---|
| Color | Green, Cold White, Blue, Black, Yellow, Red, Purple, Matte Black, Matte Green |
| Solder Mask Thickness | ≧10um(0.4mil) |
| Minimum Solder Bridge Width | Green: 0.075mm(3 mil) |
| profiling | V-cut | Angle: 25°, 30° |
| According to different plate thickness: | ||
| Remaining thickness: 0.25(10mil)-0.8mm(31mil) | ||
| Remaining thickness tolerance: ±0.1mm(4mil) |
| 1 Layer | Material | Thickness |
|---|---|---|
| Top coverlay | Capton | 1 mil(25 um) |
| Adhesive | 1 mil(25 um) | |
| Top copper layer | Copper | 1 mil(25 um) |
| Adhesive | 1 mil(25 um) | |
| Bottom Coverlay | Capton | 1 mil(25 um) |
| Total Thickness | 4 mil(125 um) | |
| 2 layers | Material | Thickness |
| top coverlay | capton | 1 mil(25 um) |
| adhessive | 1 mil(25 um) | |
| top copper layer | copper | 1 mil(25 um) |
| capton | 1 mil(25 um) | |
| bottom copper layer | copper | 1 mil(25 um) |
| adhessive | 1 mil(25 um) | |
| bottom coverlay | capton | 1 mil(25 um) |
| 7 mil | ||
| 4 layer | Material | Thickness |
| top cpverlay | capton | 1 mil(25 um) |
| adhessive | ||
| top copper layer | copper | |
| capton | ||
| 2 copper layer | copper | |
| adhessive | ||
| 3rd copper layer | copper | |
| capton | ||
| bottom copper layer | copper | |
| adhessive | ||
| bottom coverlay | capton |